Silicon stacking breakthrough: The chip industry’s upward escape from Moore’s law The semiconductor industry has spent decades chasing smaller transistors, squeezing ever more components onto flat silicon wafers until hitting a wall built by the laws of quantum mechanics. But researchers at the University of Illinois Urbana-Champaign have developed a way to stack high-performance silicon circuits directly on top of one another, and their process achieves near-perfect yields at temperatures low enough to finally make monolithic three-dimensional chips practical. This breakthrough could allow chipmakers to increase computing power without shrinking transistors any further, challenging the official story that the industry’s…

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